The H3500 high-throughput handlers are designed for the volume testing of up to 13,000 devices-per-hour.  

The handling is fully automated from the input tray to the output tray (at the end of the test), by using a fast, pick & place (test) module based on XY mechanism with linear motors and magnetic bearings. The frictionless movement of the high-speed axis, with 2 heads with 8/16 pick-ups each, guarantees reliability, extreme accuracy and no damage during touchdowns.

The modular system allows fast set-up and changeover, with easy head and pick-up replacement and kits for different device packages (PLCC, QFP, TSSOP, QFN, BGA, Micro-BGA, LGA, custom), from 2x2 to 40x40 mm size.

 

SPEA MEMS Test Cell 

- TSSOP
- PLCC
- BGA
- µ-BGA
- MMC
- QFP
- SO24
- QFN

- Productivity: up to 13.000 UPH
- Footprint: 2100 x 1200 mm
- Handling of up to 16 devices in parallel
- High-precision linear motors with magnetic guides
- Smart conversion kit for fast handler setup (apx 5 min)
- Device sorting up to 6 hardware bin
- Ionizer for device load/unload
- Communication standard (IEEE488 - TCP/IP - RS232 - TTL I/O)
- Tray magazines (up to 50 trays per magazine)
- Docking solution for tester/rate table interfacing
- SECS/GEM interface
- Device size: 2x2 to 40x40 mm
- Windows based programming software