Nodal impedance Test - NZT

SPEA NZT 2.0 is a net-oriented test technique, developed in whole by SPEA in order to reduce the test time for flying probe testing up to 80%, while guaranteeing 100% of short circuits coverageand detecting also the latent failures not covered by the in-circuit testing.

SPEA NZT 2.0 is the result of more than 10 years of enhancements made by SPEA: the new hardware and software technology offers higher accuracy and stability, a faster test execution, and a full optimization of the test time, by combining NZT test and in-circuit test.

More Information 

Pins not soldered? Open Pin Scan finds them

The increasing volume of electronic components on a board can result in a increase of process defects, starting from the lack of solder on the component pins. 

The introduction of the BGA technology limits the use of the optical inspection but it can be an efficiently substituted by the Open Pin Scan technique.

The 4020 is capable of using three different test techniques to identify different defects on the card, such as lifted pins on the board (defined as “open pin”):

- Junction Scan
- Current Scan
- Electro Scan

The combined use of the three techniques brings together the effective analysis of defects regardless of the circuit configuration and the component technology. 

With the Open Pin Scan technique, it is possible to find other defects on the tested boards, such as wrong polarity, polarized capacitors backwards, connectors mounted incorrectly, RF capacitor presence (stray capacitors).

Leonardo software automatically generates the appropriate test for the Open Pin technique, using the information contained in the CAD as reference. 

Optical Test

The 4020 can be equipped with color or black and white cameras to perform optical inspections of the board. It is possible to install up to 4 cameras for the optical testing: two on the top side and two on the bottom. 

The optical inspection module permits testing of boards at the same time the electrical testing is executed, thus guaranteeing an increase in productivity that accompanies an increase in the board coverage.

The Optical Test is useful in verifying the non-electrical characteristics of the board, or the configurations electrical testing is complex, such as:

- correct orientation of components (electrolytic capacitors, connectors, integrated circuits)
- character and symbol recognition (such as barcode 2D and device names of ICs)
- presence or absence of components 
- solder paste control

Lead Free Ready

The introduction of Lead Free soldering represents a requirement for every production area, in observance of new legislation for the environment.

Still, the technology innovations, the new required processes, together with the continuous size reduction in component packages and the PCB fine pitch devices, can increase board defects.

To guarantee the quality of the product without losing productivity, it is necessary to select a fast and flexible test system, that will be capable of finding new types of defects that can appear in the first years of using the new technology, in any production process. 

The 4020 flying prober is the ideal solution:
Immediately usable at the moment of the installation, easy to use and easy to re-program, the 4020 allows the development of any type of test. 

The extreme precision allows the system to catch more defects than any other test system, making it adequate for any new or existing type of defect.

With the Lead Free Ready technology of the 4020, SPEA demonstrates its readiness to face any environmental challenges, and re-affirms SPEA commitment to focusing on the environment.