4060 ML Manual Board Loading:
The loading of the board is easily performed directly into the testing area, guaranteeing high ergonomics in a reduced footprint.

Nodal impedance Test - NZT

SPEA NZT 2.0 is a net-oriented test technique, developed in whole by SPEA in order to reduce the test time for flying probe testing up to 80%, while guaranteeing 100% of short circuits coverageand detecting also the latent failures not covered by the in-circuit testing.

SPEA NZT 2.0 is the result of more than 10 years of enhancements made by SPEA: the new hardware and software technology offers higher accuracy and stability, a faster test execution, and a full optimization of the test time, by combining NZT test and in-circuit test.

More Information

Pins not soldered? Open Pin Scan finds them

The increasing volume of electronic components on a board can result in a increase of process defects, starting from the lack of solder on the component pins. 

The introduction of the BGA technology limits the use of the optical inspection but it can be an efficiently substituted by the Open Pin Scan technique.

The 4060 is capable of using three different test techniques to identify different defects on the card, such as lifted pins on the board (defined as “open pin”):

- Junction Scan
- Current Scan
- Electro Scan

The combined use of the three techniques brings together the effective analysis of defects regardless of the circuit configuration and the component technology. 

With the Open Pin Scan technique, it is possible to find other defects on the tested boards, such as wrong polarity, polarized capacitors backwards, connectors mounted incorrectly, RF capacitor presence (stray capacitors).

Leonardo software automatically generates the appropriate test for the Open Pin technique, using the information contained in the CAD as reference. 

Integrated On Board Programming

The 4060 allows the elimination of the need for a Workstation dedicated to device programming, placed after the board testing.

The On Board Programming (OBP) module of the 4060 can program the devices on the board. The programming can be performed for single components, as well as components in parallel.

The OBP can be used to program test functions specific to the board (Bist or Bost). It can also load the operating software of the product. This way it is possible to have one less external programming station and, at the same time, to cancel the repetitive risks of board handling. The test system works directly, using fixed commands, getting the interacting, followed by the control signals, to erase and program the component.

The programming can be done using specific connectors (for example JTAG) or using the traditional contacts of the bed-of-nails.

Optical Test

The 4060 can be equipped with color or black and white cameras to perform optical inspections of the board. It is possible to install up to 4 cameras for the optical testing: two on the top side and two on the bottom. 

The optical inspection module permits testing of boards at the same time the electrical testing is executed, thus guaranteeing an increase in productivity that accompanies an increase in the board coverage.

The Optical Test is useful in verifying the non-electrical characteristics of the board, or the configurations electrical testing is complex, such as:

- correct orientation of components (electrolytic capacitors, connectors, integrated circuits)
- character and symbol recognition (such as barcode 2D and device names of ICs)
- presence or absence of components 
- solder paste control

Boundary Scan

Testing devices that have no physical access presents no problem to the 4060.
Using the Boundary Scan technique the system is capable of testing electronic boards of high integrity and high complexity (for example BGA), verifying the pin integrity of its interconnections even when there is no probe contact. 

The 4060 can be equipped with Boundary Scan software and hardware to perform the applications of this testing technique.

Boundary Scan can be performed with different techniques, depending on the coverage that is desired: 

- Infra-structure test (integrity)
- Interconnection test
- Boundary Scan ICT test
- In-Boundary Scan test

The Boundary Scan ICT test is used when the boards are of mixed characteristics, with components of Boundary Scan typology as well as standard components (non-Boundary Scan).

In this case testing requires the use of the probe (fixed or mobile) to force or acquire digital signals simulating the presence of the Boundary Scan components where they’re not present.

The flying probes are actively used in the pattern applications of Boundary Scan to apply stabilization signals, conditioning, or to perform follow up diagnostics in depth for generic errors found in the Boundary Scan chain.

Lead Free Ready

The introduction of Lead Free soldering represents a requirement for every production area, in observance of new legislation for the environment.

Still, the technology innovations, the new required processes, together with the continuous size reduction in component packages and the PCB fine pitch devices, can increase board defects.

To guarantee the quality of the product without losing productivity, it is necessary to select a fast and flexible test system, that will be capable of finding new types of defects that can appear in the first years of using the new technology, in any production process. 

The 4060 flying prober is the ideal solution:
Immediately usable at the moment of the installation, easy to use and easy to re-program, the 4060 allows the development of any type of test. 

The extreme precision allows the system to catch more defects than any other test system, making it adequate for any new or existing type of defect.

With the Lead Free Ready technology of the 4060, SPEA demonstrates its readiness to face any environmental challenges, and re-affirms SPEA commitment to focusing on the environment.