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 Integrated MEMS/Sensors Test Cells
a single unit for testing your devices


Over 33,000 UPH P&P handling
Parametric & Functional Testing
Up to 200x sites parallel test
Specific MEMS stimulus
Full parallel Final Test Concept
Contacting Interface
100% Configurable













Handling + Testing + Specific Stimulus + Socket + Support. All by SPEA



From sockets to pickups, from tester to stimulus unit. Everything is designed and manufactured directly by SPEA for the integrated working, providing best technical performance, cost optimization, one-shot factory integration.

A single SPEA unit integrates the modules for the handling, contacting and complete testing of MEMS devices, including the physical stimulus for functional test, and the tri-temp thermal conditioning.

The cost of test results is greatly reduced, thanks to the high throughput, the lower investment,  the short application development time and the rapid accommodation of different applications.

A unique supplier for all your requirements.
This is the SPEA turnkey solution for MEMS testing.








Pick & Place Handling

Over 33,000 UPH


- Input from Tray, Bulk (bowl feeder), Wafer
- Output on tray, Tape/Reel, Bulk
- Automatic binning
- Soft-impact handling
- Quick system reconfiguration
- Fast head & pickup replacement
- Conversion kits for standard and
  customized packages
- 1x1 to 40x40 mm package size,
  with or without leads







up to 200x site Parallel Test

- Direct connection between tester and DUT:
  no signal degradation or crosstalk due to
  cable length, higher test frequency
- Up to 200x sites parallel test
- Unique workstation to control test program
  and handler
- Reduced footprint (no need for external tester)
- Cost-effective instrumentation






Complete testing with Stimulus


The test unit inside the test cell combines the proven electrical test capabilities of SPEA’s Comptest MX series, with the high-performance physical stimulus required to verify the MEMS sensor functionality. 

By simulating real world conditions, the device’s correct electrical answer to the physical stimulus is effectively tested, with best accuracy and high test parallelism.

SPEA’s stimulus range is characterized by the highest accuracy of stimulus generators and controllers, the optimal connection with the test resources so to have the best signal integrity, the possibility to integrate multiple stimuli in a single test cell for testing combo MEMS (e.g. environmental sensors, navigation sensors).











full parallel
final test concept

SPEA test cells perform the complete parametric and functional test on the fully packaged devices, at the end of the production process.

After the test, the products can be directly
shipped to the customer, without needing any further working or re-test.








Intuitive &

Operating System

- Easy-to-use programming environment
- Multi-site transparent management
- Automatic code generation
- DUT-Oriented instructions
- Off-line + on-line visual debugging
- Production control panels and
  equipment monitoring tools






Fast package changeover

All components that interface with the
device – pickups, sockets, trays… -
are quick and easy to replace


Change the package in less than 5 minutes
and re-start testing.








- temperature range: -40 ÷ +125 ºC
- temperature accuracy: ±2 ºC
- no defrost needed for intervention on
  the contactors
- 24 hours/day working without intervention
- programmable at ambient temperature
- precise tracking of thermal performance parameters
- temperature monitoring per site







100% input configurable

Input tray - loader/unloader
- 80 JEDEC trays loading capacity
- tray loading/unloading during operation
- precisor unit for device pre-alignment
- 8” wafer size (predisposed for 12”)
- Die size: 0.2x0.2x0.1 to 9x9 mm


input bulk - bowl feeder unit
- high operation autonomy
- optical check by high-speed camera
- bowl refil during handling operation
- possible concurrent installation with tray
  loading unit
- 5S inspection and optical check by
  high-speed camera



input wafer - wafer frame loader
- pick/place failure alarm
- ink inspection
- mapping sorting with alignment key
- wafer change time <15min

output bulk - box
- anti-static
- zinc-coated iron plate
- 314x130x70mm dimensions

output tape and reel - reel sort unit
- dual output reel
- masked reel exchange
- optical check of pin 1 orientation before
  tape sealing









ultra high OCR/2D
reading accuracy

The Vision Unit performs 2D code reading and OCR verifies the presence of the devices inside the input/output media, the devices orientation on x-y axis and the device's flip.

- Min code dimension reading: <0.45mm
- Code types: 1D, 2D, QR
- Min DOT dimension reading: 0.035 x 0.035mm
- Mark technology: laser, ink-jet, dot-peen, ECE