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SPEA at Productronica to highlight latest test technologies


From bed-of-nails and flying probe systems, to analog mixed signal testers and MEMS stimulus, SPEA is bringing its entire line of test equipment for electronic products at the upcoming Productronica event, which is now co-located with Semicon Europa in Munich.

The merge of these 2 major events represents a lucky occasion for SPEA to embrace the whole range of products, demonstrating an expertise that moves from the test of semiconductor wafers and packaged chips, to the production final test of electronic boards and modules. In all of these fields, SPEA’s equipment will set new standards in terms of throughput, mechanical and measurement accuracy, test coverage and reliability.
SPEA Flying Probe Series is designed to cover the widest range of test requirements for electronic boards, offering high mechanical speed, single or dual-sided probing, extreme accuracy, automatic board loading, overall configurability and fast set-up changes. At SPEA booth in Munich, all the models composing SPEA series will be available for demonstration.
4080, the top-in-class system, provides highest throughput and probing accuracy. Its mechanical speed - up to 180 touches/sec - makes it able to replace bed-of-nails systems for production test, especially when accessibility is not complete. Innovative granite chassis, combined with state-of-art linear motion technologies, offers low vibration and thermal stability, ensuring unprecedented probing precision at ultra-fast test speed.
4060 S2 is a 6-axis dual-side flying probe tester, delivering high productivity, dual- side flying probing, extra-large test area and full flexibility of use. Its versatility makes it suitable to be used also for special applications, such as semiconductor load board and probe card testing, as it will be demonstrated in Munich.
4050 S2 is a 4-axis tester designed for medium to high-volume production test. It delivers high productivity, high accuracy and a bottom moving platform to extend the probing capabilities. 
SPEA’s scalable bed-of-nails test platform delivers the highest throughput (one system is typically able to replace two to six competitor machines) and superior test coverage of component failures, process defects, components key parameters, for the widest range of electronic products. This means the system is not only able to detect board failures, but also to monitor key parameters of critical components applying real working conditions (e.g. power components, sensing components, actuators). This results in the capability to eliminate the occurrence of failures at the final functional test, while reducing to one tenth the field returns.
Parallel test with up to eight cores multiplies by eight the productivity, compared to conventional test equipment, dramatically lowering the cost of test.
The system comes with manual board loading module, or with ultra-fast inline automatic handling, to meet the requirements of fully automated productions.
An innovative multi-process platform manages the concurrent execution of multiple test techniques, optimizing the test program, that combines in-circuit test (powered-up or not), optical inspection, boundary scan test, functional test, and more. All of these functions are complemented by a friendly yet powerful software environment. 
SPEA, with its recognized industry-leading test cells for MEMS devices, combines in a single equipment all the elements of handling, contacting, physical stimulus and complete testing and calibration of MEMS and other IC devices, at ambient or temperature conditions.
On the last-born H3580 platform, multiple stimuli can be combined in a single test unit, to test combo MEMS, such as environmental sensors (pressure + humidity + gas + temperature) or navigation sensors (accelerometer + gyroscope + compass).
The new handling platform enhances throughput capabilities to over 33,000 units per hour, offering the possibility to test as many as 200 devices simultaneously.
The flexible and modular architecture facilitates an easy in-field reconfiguration of the test area, replacing MEMS stimulus units and test modules.

A zero-footprint system: no instrument cabinet, no manipulator. The possibility of a fast and simple reconfiguration, to promptly test different applications according to current production volumes. High density of analog/digital channels per board, to quadruple the test parallelism. Best signal integrity, thanks to dedicated tester interface on each instrument. These are the main features of DOT 400, the revolutionary mixed-signal tester from SPEA. 
With this system, three powerful instruments are the only resources needed to perfectly cover the requirements of most mixed-signal devices, such as automotive, PMIC, lighting, converters, MEMS applications.
The system configuration can be tailored to a defined product, avoiding any useless and costly resource redundancy. Then, if a peak of production of a different product requires a different configuration, any idle system can be easily reconfigured and moved: the reconfiguration is as simple as possible, while the system can be fastly moved thanks to its compact dimensions and manipulator-free docking system.
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