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SPEA at Apex to highlight latest flying probe and bed-of-nails test technologies


Volpiano (Italy), 20th January 2018

SPEA presented its next generation of automatic board testers – flying probe and bed-of-nails systems – at their booth #1544 in Apex, the electronic trade show held in San Diego from February 27 th to March 1 st. 





SPEA Flying Probe Series is designed to cover the widest range of test requirements for electronic boards, offering high mechanical speed, single or dual-sided probing, extreme accuracy, automatic board loading, overall configurability and fast set-up changes. At SPEA booth in San Diego, SPEA flying probers will be available for demonstration.


4080, the top-in-class system, provides highest throughput and probing accuracy. Its mechanical speed - up to 180 touches/sec - makes it able to replace bed-of-nails systems for production test, especially when accessibility is not complete. Innovative granite chassis, combined with state-of-art linear motion technologies, offers low vibration and thermal stability, ensuring unprecedented probing precision at ultra-fast test speed.


4060 S2 is a 6-axis dual-side flying probe tester, delivering high productivity, dual- side flying probing, extra-large test area and full flexibility of use. Its versatility makes it suitable to be used also for special applications, such as semiconductor load board and probe card testing, as it will be demonstrated in Munich.


4050 S2 is a 4-axis tester designed for medium to high-volume production test. It delivers high productivity, high accuracy and a bottom moving platform to extend the probing capabilities. 






SPEA’s scalable bed-of-nails test platform delivers the highest throughput (one system is typically able to replace two to six competitor machines) and superior test coverage of component failures, process defects, components key parameters, for the widest range of electronic products. This means the system is not only able to detect board failures, but also to monitor key parameters of critical components applying real working conditions (e.g. power components, sensing components, actuators). This results in the capability to eliminate the occurrence of failures at the final functional test, while reducing to one tenth the field returns.


Parallel test with up to eight cores multiplies by eight the productivity, compared to conventional test equipment, dramatically lowering the cost of test.

The system comes with manual board loading module, or with ultra-fast inline automatic handling, to meet the requirements of fully automated productions.

An innovative multi-process platform manages the concurrent execution of multiple test techniques, optimizing the test program, that combines in-circuit test (powered-up or not), optical inspection, boundary scan test, functional test, and more. All of these functions are complemented by a friendly yet powerful software environment. 

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