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Smart Card HF UHF Testers
for engineering, wafer prober and final testing

 

 

SPEA’s CT systems provide the highest parallelism in testing NFC, CPU, memory, RFID devices.  Their complete test capabilities (parametric and functional test for contact, contactless, combi devices) together with the short test time and the extreme ease of use, make these testers able to combine the lowest cost of test with the highest test coverage, at both wafer and final test.


  

  Models 

 

 

   

 

 CT1000  

    CT3000 

 High multi-site tester for smart card modules

   

Highest pin count in ID devices wafer test 

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