
H3560 pick & place handlers are designed for engineering, pre-production and production volumes of surface mount devices, with 2x2 to 40x40 mm size. They pick the components from trays, place them for mechanical stimulus and test and, at the end of the test, can put them in different stacks according to the test result (Pass/Fail).
It is a modular system, with kits for different device packages. Easy-to-use interface allows you to connect the handlers with semiconductor testers Comptest MX Series, by docking, or with MEMS stimulus units (such as the RTA Series), to stimulate MEMS devices during the test.
The production configuration can perform a fast, cost-effective, automatic multi-site handling of the devices, with a throughput of 18000 UPH. The engineering and pre-production configurations are flexible to be re-configured in a very short time.
Highlights
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Input from Tray, Bulk (bowl feeder), Carrier
Output on tray, Tape/Reel, Bulk, Carrier
Automatic binning
Zero-shock handling
2 XYZ high-speed heads, with 4/8/16 pick-ups each
- Frictionless movement design
- Magnetic guides and linear motors
- Up to18.000 UPH
Quick system reconfiguration
- Fast head & pickup replacement
- Conversion kits for standard and customized packages
- 2x2 to 40x40 mm package size
- Handling of components with or without leads & BGA
Working conditions: Room, Dual-Temp, Tri-Temp
- Nitrogen-less temperature conditioning
Flexible interface for easy connection with Comptest MX testers and stimulus units
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Handling Flow

LOADING
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I/O on Trays
- Tray type: JEDEC
- 8 slots for single or multi tray (magazine)
- Magazine capacity up to 50 trays
- Possibility to load/unload the trays from/to the magazine during the normal operation of the system
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Input from Bowl Feeder
- High operation autonomy
- Device orientation optical check by using high-speed camera
- Possibility of concurrent installation with the tray loading unit
- Bowl refill during handling operation
- Warning alarm for low autonomy
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TESTING
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Engineering and production configurations
The production configuration is designed for the cost effective handling of devices in production environment. In this configuration, the handling is fully automated from the input tray to the output tray by using a fast pick& place module based on XY mechanism with linear motors and magnetic bearings.
The engineering and pre-production configurations are flexible systems with a very short setup time.
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Handling & Turn Key Solution
H3560 handler can be easily connected by docking with the Comptest MX Mixed Signal testers, so to provide a turn key solution for device automation and testing. The flexible docking system allows you to connect the handler also with testers made by third parts. |
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Stimulating device
H3560 handlers can be connected by docking with the SPEA MEMS Stimulus Unit, to stimulate devices such as MEMS.
This multi-axis positioner is designed to ensure the highest positioning accuracy and repeatability.
The Stimulus is perfectly integrated in the handler, and its use is managed by the tester programming system.
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UNLOADING
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Output On Tape On Reel
RSU - Reel Sort Unit
SPEA MEMS Test Cells and pick&place test handlers, equipped with the RSU Reel Sort Unit, can perform the tray-to-reel handling of the tested devices. This configuration offers high throughput, full automation, high reliability, with the possibility to choose if placing the devices in tray or in reel, according to the single application, on the same equipment.
The handling is based on a fast pick and place unit that picks the tested PASS components from the testing area, and place them on one or two automatic tape transport units.
High reliabiltiy is guaranteed by the optical inspection, performed when the components are placed into the tape pockets, in order to verify their correct position and orientation.
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The P&P and tape transport units
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Software interface: main panel
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Software interface: optical verification
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- Single or Dual Reel Sorting
- Reel exchange <5min (masked on dual reel sorting version)
- Kit exchange <10 min
- Multiple lot management
- Optical verification before tape sealing
- Field upgradeable on all SPEA test cells and handlers
RSU Specifications:
Throughput: 6500 UPH
Jam rate: < 1/5000
Tape width: 8, 12, 16, 24mm
Sealing unit type: Pressure
Pick&Place pickups: Up to 16
Optical verification: Device presence - Device orientation
Package Kit Available

Tri-Temp Conditioning System
| - Nitrogenless
- No defrost needed for intervention on the sockets
- 24 h/day working without interruption
- Accurate temperature control at full temperature range
- Controlled ambient temperature
- Precise tracking of thermal performance parameters
- Temperature monitoring per site
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Intuitive, User-Friendly Software
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- Touch Screen Graphic Interface
- Graphic Tray Mapping
- Graphic Representation of:
Trays
Bin/Input/Output Buffers
- Tray Device Counter
- Real Time Statistics
JAM
UPH
Bin
MTBS
- Real Time Socket Yield
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Specifications
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| Throughput |
up to 18000 UPH @ test time=0 |
| Device size |
QFP, LGA, QFN, BGA, BGA, PLCC, TSSOP |
| Multisite |
from 2x2 to 40x40 mm |
| Parallel Handling |
4-8-16 components |
| Smart Conversion kit for fast handler setup |
Yes |
| Devices Sorting |
up to 6 hardware bin |
| Communication Standards |
IEEE488 - TCP/IP - RS232 - TTL I/O - SECS/GEM |
| Jedec Trays magazines |
up to 50 trays per magazine |
| Test Area options |
Tester docking / RTA |
| Footprint |
2200 x 1400 mm |
TSL/STR accomodation
(Tray Stack Loader / Single Tray Receiver) |
8 slots |