May 05, 2023
Meet us at SMTconnect 2023
SPEA, leader in the design and manufacturing of ATE for electronics, will be present at SMTconnect 2023 trade fair in Nuremberg, Germany at Booth 124 | Hall 4A to demonstrate the quality and reliability of SPEA’s Ingegno Italico, the brilliant ingenuity at the basis of innovation.
SMTconnect is the trade fair for electronic products in Europe that brings people and technologies from the areas of development, production, services, and the applications of microelectronic assemblies and systems together in an inspiring work atmosphere. In this context, SPEA will exhibit 4080 flying probe tester and 3030IL bed-of-nails tester, fully conceived to support electronics manufacturers in eliminating the risk of field failures while saving on the cost of testing.
The best solution for electronic board testing, with unbeatable throughput and fault coverage – 4080
The 4080 is conceived for the most demanding electronics manufacturers to cut the cost-of-test. It provides the highest throughput for flying probe testing as it can test 800,000+ boards per year. The double-sided high-speed moving axes, micro-probing accuracy, multidisciplinary test capability, and flexible scalability allow electronics manufacturers to ensure zero-failure escape in a wide range of applications at the highest throughput.
The 4080 is an automatic Flying Probe Tester that can mount 28 different flying tools, chosen among over 50 ones. The combination of electrical tests, optical inspections, thermal tests, 3D scan, and many others brings the most comprehensive test coverage. It is suitable to be used for lab certifications, as well as to perform complete, high-throughput production tests also on the most advanced and miniaturized assemblies.
The In-Circuit Tester with 4 independent test cores for parallel PCBAs testing – 3030IL
3030IL is the fully automatic bed-of-nails tester expressly designed to minimize the cost of test, providing unparalleled throughput without requiring the operator to load the PCB or perform the test. It can be equipped with up to 4 independent test cores able to test in parallel up to 4 boards/panels of boards. Its dedicated CPU on each Core guarantees no delay between instrumentation and PC. Compared to standard ICT testers, 3030IL throughput is up to 400% higher, thus minimizing the cost of the test.
3030IL is compliant with SMEMA and HERMES standards. It can be easily integrated into SMT lines and fully automated productions. It can work also as a single test cell when equipped with SPEA board loading modules.
Visit Booth 124 | Hall 4A on May 9-11, 2023, and have a talk with our highly qualified staff about the best SPEA solution for your needs!
