SPEA at Nepcon China 2021
April 21-23 at booth #1K35
Discover our newest test products at the
Shanghai World Expo Exhibition & Convention Center
SPEA will present its next generation of automatic board testers – flying probe and bed-of-nails systems – at booth #1K-35 in Nepcon China, the electronics trade show held in Shanghai from April 21st through 23rd. After almost a year of stop, due to global pandemic, trade shows are gradually reopening to the public and SPEA is pleased to be present at Nepcon China with its testing equipment. SPEA is healthy and strong and has been active all this time, also participating in virtual shows. Nepcon China is the second in-person event that SPEA attends in 2021 and is already working for the next trade shows.
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SPEA 4080
Flying Probe Tester
Over 800.000 boards tested per year.
4080 sets new benchmarks for flying probe board testing. Full test coverage is provided by a complete range of test capabilities integrated in 4080 systems, and by the highest available measurement accuracy offered by Flying Tester Technology: a complete forcing / measurement board integrated on each axis.
SPEA 3030IL
In-Circuit Tester
High volumes. Low cost of test.
3030IL is the fully automatic bed-of-nails tester expressly designed to minimize the cost of test, providing unparalleled throughput without requiring the operator to load the PCB or perform the test. It can be quickly integrated into SMEMA production lines, or used with automatic board loader/unloader.
SPEA 4060
Flying Probe Tester
Test even the largest boards.
The large test area allows 4060 S2 to fit boards with up to 1524 x 610mm (60 x 24’’) size, while the input conveyor module makes it easy to load the heaviest boards (e.g. load boards, power modules, telecom boards), up to 20Kg weight, which are automatically loaded into the test area.