SPEA reveals noteworthy technologies to the upcoming Semicon West

Look into the 5G test solution (5G and Car Radar) and the TH2000 wafer prober and tester

Italy, San Francisco, November 22nd, 2021 – SPEA is deeply enthusiastic about its participation as an exhibitor in the Semicon West show. We trust in meeting our valued customers and new potential audience at the Moscone Center in San Francisco from Dec. 7th to Dec. 9th, 2021.

Some of the highest new technologies will be displayed at Booth #1139 by our qualified team.

5G Test Solution – an effective and affordable test solution for 5G devices with the world’s most advanced ultra-wideband RF processor.

Millimeter wave device technology, or 5G technology, is opening up a new world of possibilities across many industries, delivering unprecedented performance in wireless connectivity. SPEA is collaborating with the Israeli ATS to provide an effective and affordable test solution for 5G devices in low band, mid band and high band frequencies, up to 81 GHz, delivering low cost of test and high test coverage.

ATS’ test-on-board technology, integrating RF test resources directly on the tester load board, extends SPEA DOT800 testers’ capabilities for RF 5G applications without needing dedicated RF testers.

This cutting-edge, production-ready testing solution brings several key advantages:

Highly accurate real-time testing of T/R properties
Significant reduction in production RF test costs
Multi-site scalability: one module supports multiple sites, while multiple modules can be mounted on the same load board
Independent frequency bands in TX and RX
Functional test with complex signals
Power reading and signal sourcing

TH2000 – the innovative double-sided wafer prober and tester.

TH2000 is a revolutionary system which combines double-sided wafer probing capability with comprehensive test resources, including electrical test, HV/HI test, warpage and surface verification, and optical inspection.

The system performs complete, high-throughput tests at wafer level for the most challenging applications, including power devices, optoelectronics, pass-through dies, multi-project wafers, complex systems-on-a-chip and unconventional layouts, with size up to 12” (300mm).

The probing technology based on multiple, flying probe cards, and the lean test process (all the tests required at wafer level are performed in a single step) make TH2000 able to dramatically lower your cost of test.

Stop over Booth #1139 and have a talk with a highly proficient staff about the best SPEA solutions that fits you best!

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