Over 800.000 boards tested per year

30-50µm contactable pad

Operatorless testing

Easy to use

The best for electronic board testing

Unbeatable in throughput and fault coverage

SPEA automatic flying probe testers for electronic boards stand out for their unsurpassed throughput performance and for their excellent fault coverage.

The main advantage of flying probe testers is that they are immediately ready to test every new product, without needing any specific interface fixture or testability study.
To this feature, SPEA systems add complete automation both in test program development and in system operation. Starting from CAD files, the generation of an in-circuit test program is completely automatic, as well as the fine-tuning and stabilisation of the measurements: in a few hours, the test program is ready to run. The tester operation can be completely automatic, without any operator’s intervention: with the aid of SPEA Loading Modules from rack and SPEA Buffer Modules, the flying prober can run over an entire work shift or a weekend in full autonomy.

Ultra-fast probes are able to contact points as small as 30 µm and, therefore, they can directly contact the pins of the smallest components on the board: it is no longer necessary to include special test pads in the printed circuit board design. This accuracy is stable over time, thanks to linear optical encoders in XYZ which give continuous feedback on the real probe positioning, with a resolution of 12 nanometers.
Moreover, the motion profile of the probes avoids the risk of damaging the contacted points, for a zero-impact contacting also in case of multiple probings on the same point.

SPEA flying probe series includes different models, so as to cover different production needs from high volumes – over 800.000 boards per year – to low volumes, to NPI and prototypes. Every model can be equipped with different modules and tools to test different products such as electronic boards, flexible circuits, power modules, back planes, semiconductor test load boards and probe cards, ceramic devices, microelectronics and silicon wafers.

Applications

Electronic Board Test

Flexible Circuit Test

SPEA Power Board Tester

Power Board Test

LED Board & Panel Test

SPEA Automatic Flying Probe Tester for Probecard

Probe Card Test

Load Board Test

Top Features

Unparalleled throughput

Ultra Positioning Accuracy

No Damage Touch

Short Circuit Test on all nets

Automatic Board Loading

Intuitive software

Test Techniques

Light Test

Laser Test

Optical Test

Power-On Test

SPEA Automatic Flying Probe Tester

RF Test

SPEA Automatic Flying Probe Tester

All-Nets Structural Test

Find the right tester for your needs

Compare Flying Probe models


40804080X4085406040504020
THROUGHPUT
UPH (UPY)
[340 net - 357 components]
128 (1 Mln)*128 (1 Mln)*128 (1 Mln)*83 (660 k)*47 (372 k)*31 (246 k)*
UPH (UPY)
[1000 net - 600 components]
63 (500 k)*63 (500 k)*63 (500 k)*41 (330 k)*34 (270 k)*22 (180 k)*
PROBING
Top Flying Heads4x4x4x4x4x4x
Bottom Flying Heads4x4x4x2x--
Bottom Lift----1x1x
Contactable pad (min) [µm]303030707070
AUTOMATIC LOADING
From RackYesYesYesYesYesYes
From Conveyor/LineYesYesYesYesYesYes
DIMENSIONS
Dimensions [HxLxW]1700 x 1300 x 2050 mm
67 x 51 x 81 inches
1700 x 1438 x 2080 mm
67 x 57 x 82 inches
1285 x 1000 x 2063 mm
51 x 40 x 81 inches
1750 x 1272 x 1724 mm
69 x 50 x 68 inches
1600 x 1220 x 1660 mm
63 x 48 x 65 inches
1600 x 1220 x 1660 mm
63 x 48 x 65 inches
UUT Size (max) [LxW]1000 x 460 mm
40 x 18 inches
1000 x 460 mm
40 x 18 inches
500 x 190 mm
20 x 7.5 inches
1524 x 610 mm
60 x 24 inches
1000 x 400 mm
40 x 16 inches
1000 x 400 mm
40 x 16 inches
Device Height (Top/Bottom)85/85 mm
3.4/3.4 inches
150/150 mm
5.9/5.9 inches
45/45 mm
1.8/1.8 inches
80/55 mm
3/2 inches
55/90 mm
2/3.5 inches
55/90 mm
2/3.5 inches
Flexible Circuit on Reel Width190 mm
7.5 inches
190 mm
7.5 inches
190 mm
7.5 inches
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* 8h, 3 shifts, 330 days

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