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Smart Card HF UHF Testers
for engineering, wafer prober and final testing



SPEA’s CT systems provide the highest parallelism in testing NFC, CPU, memory, RFID devices.  Their complete test capabilities (parametric and functional test for contact, contactless, combi devices) together with the short test time and the extreme ease of use, make these testers able to combine the lowest cost of test with the highest test coverage, at both wafer and final test.









 High multi-site tester for smart card modules


Highest pin count in ID devices wafer test 

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